Tosun’s AI testing solution is designed for OEMs, component suppliers and semiconductor manufacturers, delivering a full-chain testing workflow covering requirements management, test-case generation, automated execution, report generation and ASPICE-compliant traceability. Built on the TSMaster, the solution integrates five AI agents to enable intelligent requirement decomposition, automatic test-case generation, automated report writing and proactive anomaly alerts. It significantly improves testing efficiency, reduces compliance costs and accelerates software iteration.  

The newly upgraded chip-level testing solution is deeply integrated with TSMaster, supporting fully automated testing and multiformat report export. The hardware platform has been upgraded to 0-60V/0-10A, compatible with 12V, 24V and 48V vehicle platforms. The solution provides full-layer bus consistency validation from chips and ECUs to systems and real vehicles. It also includes a standard test-case library compliant with mainstream domestic and international standards, while supporting customized secondary development. Key advantages include end-to-end automation, high-performance hardware and full-scenario coverage.  

In addition, Tosun will showcase hardware and TSMaster functionalities supporting next-generation bus protocols such as CAN XL and 10BASE-T1S. The solutions cover the entire workflow from development to testing and validation for OEMs, component suppliers and semiconductor manufacturers, providing solid support for the R&D and verification of next-generation intelligent vehicle communication architectures.  

Booth 3052