HTRB/HTGB Dynamic and static pressure integrated burn-in system
HTDGS (The high-temperature dynamic gate bias test system) is mainly used for the power semiconductor dynamic gate bias burn-in test, and the equipment can apply a specified gate bias pressure(Voltage can be configured according to customer requirement), test software can setup the measurement parameters and monitor parameters, collect and record all real-time test parameters.
HTDGS (The high-temperature dynamic gate bias test system) is mainly used for the power semiconductor dynamic gate bias burn-in test, and the equipment can apply a specified gate bias pressure(Voltage can be configured according to customer requirement), test software can setup the measurement parameters and monitor parameters, collect and record all real-time test parameters, Such as temperature, time, voltage, leakage current, etc., during the test process, the threshold voltage VGETH and other parameters can be monitored according to the program setting requirements. The threshold voltage measurements meet the standards AQG324, JEP183A Gated-diode method, and refer to JEP184 measure circuit mode.
Booth: 8220
Booth: 8220
