August 26–28, 2026
Shanghai World Expo Exhibition and Convention Center

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Modular 6DoF sensor series

G&P Technology Ltd., Hall: 1 Stand: 7020
Modular 6DoF sensor series

Endevco has launched a new angular rate and 6DoF sensor series including 7310A/7330/7360A, 773A/776. Adopting silicon-based MEMS gyro tech, it delivers accurate performance under strong shock and high vibration. Two solutions – modular stacking and an integrated six-axis package – are available. Covering angular rate of ±100~±18,000°/sec and acceleration of ±500~±2,000g, it suits vehicle dynamics, aircraft testing and more. With low range and high sensitivity, it provides reliable measured data. 

Booth 7020 

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